BGL-GZ-83: Anti-sticking layer for Nanoimprint Lithography

Fast & Easy: Anti-Sticking Layer for Nanoimprint Stamp

A critical step in the nanoimprint process is the separation of the stamp and the substrate after hardening of the photoresist.  To prevent sticking, the surface energy of the stamp must be minimised.  Normally, this happens with the aid of an anti-sticking layer that reduces the surface energy on the stamp.

Conventional anti-sticking layers have to be applied to the stamp from the gas phase in a complex process (e.g. F13TCS), for which complex test superstructures are required. In contrast to this, only a spin coater is needed for the application of a BGL-GZ-83 anti-sticking layer, in order to create a coating that is suitable for imprints of down to sub 100nm.

The greatest benefit of BGL-GZ-83 is the fast and easy application, because the layer is applied on the stamp in just a few minutes. To do this, the stamp is fastened in the spin coater, BGL-GZ-83 is applied and then centrifuged.  Another benefit is that this can take place in normal room temperature and air.

Depending on the photoresist and the cleaning of the stamp, one coating of BGL-GZ-83 can withstand more than 50 imprints.